Mechanic XG-80 Solder Paste for BGA reball

Mechanic XG-80 Solder Paste for BGA reball

MECSP-XGSP80
Regular price NZ$19.99
Regular price Sale price NZ$19.99
Sale Sold out
Email me when back in stock
inc GST
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Mechanic XG-80 Solder Paste for BGA reball

Mechanic XG-80 Solder Paste for BGA reball

MECSP-XGSP80
Regular price NZ$19.99
Regular price Sale price NZ$19.99
Sale Sold out
inc GST
Email me when back in stock
  • Top brand Mechanic Solder Paste
  • 60g Solder tin paste with IPX3 flux for a 183℃ melting point
  • Sn63/Pb37 Alloy
  • Suitable for reballing BGA chips or welding in electronic componets
Regular price NZ$19.99
Regular price Sale price NZ$19.99

Dispatches next business day straight from our NZ warehouse

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Product Details

The Mechanic XG-80 (now known as XGSP80) High Quality Solder Welding Paste is widely used for mobile phone, computers and other electronic chips for repair and maintenance. Designed with high-grade rich solder, it has no faulty soldering so you can be confident when repairing

  • Professional Mechanic XG-80 Solder Paste
  • 183℃ melting point 
  • 60g tub
  • IPX3 flux
  • Sn63/Pb37 Alloy


Warranty

Compatibility

  • Brand: Mechanic
  • Model: XGSP80 or XG-80
  • Alloy: Sn63/Pb37
  • Microns: 25-45um
  • Flux: IPX3
  • Weight: 60g
  • Melting Point: 183℃
  • Suitable for mobile and electronic repair including BGA reballing

What’s In The Box

  • 1x Mechanic XG-80 Solder Paste